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HAD8635
    发布时间: 2019-06-30 16:55    

HAD8635

连线式COBPCB平面式固晶机

(周期:240ms

适用于印刷锡膏后的COBPCB固晶。

 

一、机型特性

1.平面式印刷锡膏后的COBPCB自动固晶的最佳选择;

2.固晶周期240ms/颗,每小时产量为15K、精准的自动化设备为企业提高生产效率、降低成本提供了有效保障,从而切实有效地提高了企业竞争力;


4.采用左进料和右出料的连线方式,方便流水线式生产。

5.采用直驱电机驱动邦头;

6.线性电机驱动晶片搜寻平台(X/Y)与固晶平台(B/C);

7.采用真空漏晶检测;

8.工控机控制设备运行,简化了自动化设备的操作。

 

HAD8635

Wired COB, PCB Plane-type Die Bonder

Cycle: 240ms

It is compatible with the printed solder paste COB, PCB die bond

 

Product Features

1.      It is the best choice for the printed solder paste COB, PCB automatic die bond;

2.      The cycle of die bond is 300ms/ piece, 12K UPH, sophisticated equipment will help improve your enterprise’s production efficiency and reduce relevant costs so as to provide effective guarantee and enhance the enterprise’s competitiveness;

3.      Precise die bond location and excellent compatibility will guarantee the back-end processing; meanwhile, precise die bond location will also guarantee the high quality of LED products;

4.      The left loading and right unloading method made it convenient for line production;

5.      Linear motor is applied to drive bond head;

6.      Linear motor will drive the die to search corresponding platform(X/Y) and corresponding loading platform (B/C);

7.      Vacuum die missing testing technology is adopted;

8.      IPC will control the operation of equipment, simplifying the operation of automation equipment.


二、规格参数

Specifications and Parameters

 

1.系统功能/System Function

4.吸晶摆臂机械手系统/Die Bonder’s Swing Arm-and-hand system

生产周期/Production Cycle

240ms(取决于晶片尺寸及支架)(Depending On Die Size And Holder)

吸晶摆臂/Swing Arm of Die Bonder

180°可旋转固晶(Rotatable Die Bond)

XY位置精度/Accuracy

±0.8mil(±0.02mm

吸晶压力/Die Bond Pressure

可调20g250g(Adjustable)

芯片旋转/Die Rotation

±2°

5.送料工作平台/Loading Workbench

2.芯片XY工作台/Die XY Workbench


行程范围/Range of Stroke

支架长/Length200mm-550mm.

支架宽/Width100mm-420mm.

芯片尺寸/Die Dimensions

4mil×4mil-80mil×80mil
(0.1mm*0.1mm-2mm*2mm)

固晶范围/Range of Die Bond

210mm*550mm

最大芯片环尺寸/Max. Die Ring Size

6″(152mm)外径(External Diameter)

XY分辨率/XY Resolution

0.02mil0.5μm

最大芯片面积尺寸/Max. Die Area

4.7119mm)扩张后(Expanded)

6.所需设施/Facilities Needed

分辨率/Resolution Ratio

0.04mil  (1μm)

电压/频率/Voltage/Frequency

220V AC±5%/50HZ

顶针Z高度行程/Thimble Z Height Stroke

80mil2mm

压缩空气/Compressed Air

0.5MPaMIN

额定功率/Rated Power

665W

3.图像识别系统/Image Recognition System

耗气量/Gas Consumption

5L/min

灰阶度/Grey Scale

256级灰度(Level Grey)

7.体积及重量/Volume and Weight

分辨率/Resolution

512×512像素(Pixels)

xx/

Length x Width x Height

233×123×200cm

图像识别精准度/Image Recognition Accuracy

±0.025mil@50mil观测范围(Observation Range)

重量/Weight

1220kg


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